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CPU Thermally conductive pad

MOQ : piece

Lead Time : Days

Seller Support : Trade Authenticity Guaranteed & Accepting

Payment : L/C,T/T,Western Union, Money Gram, Credit Card, Paypal

Product details

Supply Ability

  • Warranty(Year):1 Year

Product Specifications

Product Description

it is designed with very good high thermal conductivity and coherent winding, its thermal conductivity in the thermally conductive gap filling materials is unparalleled.

 Features & benefits:

1.High compressibility, soft and flexible, designed for applications in low-stress application environment

2. Nice thermal conductivity

3. Electrical insulation

4. Meet with the environmental requirements of ROHS and UL

5. Natural stickiness

Typical applications:

1 .Laptop

2. Communication hardware equipment

3. High-speed hard disk drive equipment

4. Automobile engine control mould

5. Micro processor, memory chip and graphics processor

6  Mobile equipment

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